Interfacial reactions between SAC405 and SACNG lead-free solders with Au/Ni(P)/Cu substrate reflowed using the CO~2 laser and hot-air methods: Fid-Bau Portal

Interfacial reactions between SAC405 and SACNG lead-free solders with Au/Ni(P)/Cu substrate reflowed using the CO~2 laser and hot-air methods

Yen, Y.-W. / Hsiao, H.-M. / Lo, S.-C. / Fu, S.-M.

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Interfacial reactions between SAC405 and SACNG lead-free solders with Au/Ni(P)/Cu substrate reflowed using the CO~2 laser and hot-air methods

Yen, Y.-W. / Hsiao, H.-M. / Lo, S.-C. / Fu, S.-M.

Interfacial reactions between SAC405 and SACNG lead-free solders with Au/Ni(P)/Cu substrate reflowed using the CO~2 laser and hot-air methods

Yen, Y.-W. / Hsiao, H.-M. / Lo, S.-C. / Fu, S.-M.

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Check availability in my library

Order at Subito €

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Document information

Title:

Interfacial reactions between SAC405 and SACNG lead-free solders with Au/Ni(P)/Cu substrate reflowed using the CO~2 laser and hot-air methods

Contributors:

Yen, Y.-W. (author) / Hsiao, H.-M. (author) / Lo, S.-C. (author) / Fu, S.-M. (author)

Published in:

INTERNATIONAL JOURNAL OF MATERIALS RESEARCH ; 104 ; 637-642

Publication date:

2013-01-01

Size:

6 pages

ISSN:

1862-5282

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 669.9

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