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Interfacial reactions between SAC405 and SACNG lead-free solders with Au/Ni(P)/Cu substrate reflowed using the CO~2 laser and hot-air methods
Interfacial reactions between SAC405 and SACNG lead-free solders with Au/Ni(P)/Cu substrate reflowed using the CO~2 laser and hot-air methods
Interfacial reactions between SAC405 and SACNG lead-free solders with Au/Ni(P)/Cu substrate reflowed using the CO~2 laser and hot-air methods
Yen, Y.-W. (author) / Hsiao, H.-M. (author) / Lo, S.-C. (author) / Fu, S.-M. (author)
INTERNATIONAL JOURNAL OF MATERIALS RESEARCH ; 104 ; 637-642
2013-01-01
6 pages
Article (Journal)
English
DDC:
669.9
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