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A new approach for evaluating thin film interface fracture toughness

Wang, J. A. / Wright, I. G. / Lance, M. J. / Liu, K. C.

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A new approach for evaluating thin film interface fracture toughness

Wang, J. A. / Wright, I. G. / Lance, M. J. / Liu, K. C.

A new approach for evaluating thin film interface fracture toughness

Wang, J. A. / Wright, I. G. / Lance, M. J. / Liu, K. C.

Access

Access via TIB

Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

A new approach for evaluating thin film interface fracture toughness

Contributors:

Wang, J. A. (author) / Wright, I. G. (author) / Lance, M. J. (author) / Liu, K. C. (author)

Published in:

MATERIALS SCIENCE AND ENGINEERING A ; 426 ; 332-345

Publication date:

2006-01-01

Size:

14 pages

ISSN:

0921-5093

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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