Fachinformationsdienst BAUdigital

A platform for research: civil engineering, architecture and urbanism

    Component Candidacy of Second Side Reflow with Lead-Free Solder

    New search for: Liu, Y.
    New search for: Geiger, D. A.
    New search for: Shangguan, D.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Component Candidacy of Second Side Reflow with Lead-Free Solder

    New search for: Liu, Y.
    New search for: Geiger, D. A.
    New search for: Shangguan, D.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Component Candidacy of Second Side Reflow with Lead-Free Solder

    New search for: Liu, Y.
    New search for: Geiger, D. A.
    New search for: Shangguan, D.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Component Candidacy of Second Side Reflow with Lead-Free Solder

    Contributors:

    Liu, Y. (author) / Geiger, D. A. (author) / Shangguan, D. (author)

    Published in:

    MATERIALS TRANSACTIONS ; 47 ; 1577-1583

    Publication date:

    2006-01-01

    Size:

    7 pages

    ISSN:

    1345-9678

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

    Similar titles

    Reflow of lead-free solder by microwave heating

    Ju, Yang / Yamauchi, Hayato / Oshima, Hiroki et al. | British Library Online Contents | 2014

    Characteristics of Laser Reflow Bumping of Sn3.5Ag and Sn3.5Ag0.5Cu Lead-Free Solder Balls

    Tian, Y. / Wang, C. / Chen, Y. | British Library Online Contents | 2008

    N~2 Inerting for Reflow of Lead-free Solders

    Dong, C. C. / Ross, B. F. / Schwarz, A. | British Library Online Contents | 2003

    Non-Equilibrium Thermodynamic Theory of 4-Component Lead-Free Solder

    Suetsugu, K. / Yamaguchi, A. / Matsushige, K. et al. | British Library Online Contents | 2009

    Lead-free Solder Wafer Bumping

    Dimock, F. / Mattson, K. | British Library Online Contents | 2004

    Back to top