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    Characteristics of Laser Reflow Bumping of Sn3.5Ag and Sn3.5Ag0.5Cu Lead-Free Solder Balls

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    New search for: Wang, C.
    New search for: Chen, Y.

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    Characteristics of Laser Reflow Bumping of Sn3.5Ag and Sn3.5Ag0.5Cu Lead-Free Solder Balls

    New search for: Tian, Y.
    New search for: Wang, C.
    New search for: Chen, Y.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Characteristics of Laser Reflow Bumping of Sn3.5Ag and Sn3.5Ag0.5Cu Lead-Free Solder Balls

    New search for: Tian, Y.
    New search for: Wang, C.
    New search for: Chen, Y.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Characteristics of Laser Reflow Bumping of Sn3.5Ag and Sn3.5Ag0.5Cu Lead-Free Solder Balls

    Contributors:

    Tian, Y. (author) / Wang, C. (author) / Chen, Y. (author)

    Published in:

    JOURNAL OF MATERIALS SCIENCE AND TECHNOLOGY -SHENYANG- ; 24 ; 220-226

    Publication date:

    2008-01-01

    Size:

    7 pages

    ISSN:

    1005-0302

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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