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    Reflow of lead-free solder by microwave heating

    New search for: Ju, Yang
    New search for: Yamauchi, Hayato
    New search for: Oshima, Hiroki
    New search for: Tanaka, Kensuke

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    Reflow of lead-free solder by microwave heating

    New search for: Ju, Yang
    New search for: Yamauchi, Hayato
    New search for: Oshima, Hiroki
    New search for: Tanaka, Kensuke

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Reflow of lead-free solder by microwave heating

    New search for: Ju, Yang
    New search for: Yamauchi, Hayato
    New search for: Oshima, Hiroki
    New search for: Tanaka, Kensuke

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Reflow of lead-free solder by microwave heating

    Contributors:

    Ju, Yang (author) / Yamauchi, Hayato (author) / Oshima, Hiroki (author) / Tanaka, Kensuke (author)

    Published in:

    International journal of materials and structural integrity ; 8 ; 32-41

    Publication date:

    2014-01-01

    Size:

    10 pages

    ISSN:

    1745-0055

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.112

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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