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Lead-free photoimageable silver conductor paste formulation for high density electronic packaging

Ketkar, S. A. / Umarji, G. G. / Phatak, G. J. / Ambekar, J. D. / Rao, I. C. / Mulik, U. P. / Amalnerkar, D. P.

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Lead-free photoimageable silver conductor paste formulation for high density electronic packaging

Ketkar, S. A. / Umarji, G. G. / Phatak, G. J. / Ambekar, J. D. / Rao, I. C. / Mulik, U. P. / Amalnerkar, D. P.

Lead-free photoimageable silver conductor paste formulation for high density electronic packaging

Ketkar, S. A. / Umarji, G. G. / Phatak, G. J. / Ambekar, J. D. / Rao, I. C. / Mulik, U. P. / Amalnerkar, D. P.

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Access via TIB

Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

Lead-free photoimageable silver conductor paste formulation for high density electronic packaging

Contributors:

Ketkar, S. A. (author) / Umarji, G. G. (author) / Phatak, G. J. (author) / Ambekar, J. D. (author) / Rao, I. C. (author) / Mulik, U. P. (author) / Amalnerkar, D. P. (author)

Published in:

MATERIALS SCIENCE AND ENGINEERING B -LAUSANNE- ; 132 ; 215-221

Publication date:

2006-01-01

Size:

7 pages

ISSN:

0921-5107

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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