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Pressureless Bonding by Micro-Sized Silver Particle Paste for High-Temperature Electronic Packaging
Pressureless Bonding by Micro-Sized Silver Particle Paste for High-Temperature Electronic Packaging
Pressureless Bonding by Micro-Sized Silver Particle Paste for High-Temperature Electronic Packaging
Roh, Myong-Hoon (author) / Nishikawa, Hiroshi (author) / Tsutsumi, Seiichiro (author) / Nishiwaki, Naruhiko (author) / Ito, Keiichi (author) / Ishikawa, Koji (author) / Katsuya, Akihiro (author) / Kamada, Nobuo (author) / Saito, Mutsuo (author)
Materials transactions ; 57 ; 1209-1214
2016-01-01
6 pages
Article (Journal)
English
DDC:
620.1105
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