A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
Failure Modes and FEM Analysis of Microelectronic Packaging
Failure Modes and FEM Analysis of Microelectronic Packaging
Failure Modes and FEM Analysis of Microelectronic Packaging
Lu, G. Y. (author) / Hu, D. Y. (author) / Aliabadi, M. H. / Li, Q. / Li, L. / Buchholz, F.-G.
2006-01-01
4 pages
Article (Journal)
English
DDC:
620.11
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