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    Characteristics of the Electroless-Deposited Cu Film as Interconnect on a TaN Diffusion Barrier

    New search for: Kim, J. S.
    New search for: Kang, S.-G.
    New search for: Kobayashi, T.

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    Characteristics of the Electroless-Deposited Cu Film as Interconnect on a TaN Diffusion Barrier

    New search for: Kim, J. S.
    New search for: Kang, S.-G.
    New search for: Kobayashi, T.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Characteristics of the Electroless-Deposited Cu Film as Interconnect on a TaN Diffusion Barrier

    New search for: Kim, J. S.
    New search for: Kang, S.-G.
    New search for: Kobayashi, T.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
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    Document information
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    Document information
    Title:

    Characteristics of the Electroless-Deposited Cu Film as Interconnect on a TaN Diffusion Barrier

    Contributors:

    Kim, J. S. (author) / Kang, S.-G. / Kobayashi, T.

    Published in:

    Designing, Processing and Properties of Advanced Engineering Materials PART 2 ; 681-684

    MATERIALS SCIENCE FORUM ; 449/452

    Publication date:

    2004-01-01

    Size:

    4 pages

    ISSN:

    0255-5476

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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