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    New composites with high thermal conductivity and low dielectric constant for microelectronic packaging

    New search for: Ling, W.
    New search for: Gu, A.
    New search for: Liang, G.
    New search for: Yuan, L.

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    New composites with high thermal conductivity and low dielectric constant for microelectronic packaging

    New search for: Ling, W.
    New search for: Gu, A.
    New search for: Liang, G.
    New search for: Yuan, L.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    New composites with high thermal conductivity and low dielectric constant for microelectronic packaging

    New search for: Ling, W.
    New search for: Gu, A.
    New search for: Liang, G.
    New search for: Yuan, L.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    New composites with high thermal conductivity and low dielectric constant for microelectronic packaging

    Contributors:

    Ling, W. (author) / Gu, A. (author) / Liang, G. (author) / Yuan, L. (author)

    Published in:

    POLYMER COMPOSITES ; 31 ; 307-313

    Publication date:

    2010-01-01

    Size:

    7 pages

    ISSN:

    0272-8397

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.192

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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