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    Growth Behavior of Intermetallic Compounds on Sn-3.5Ag-0.5Cu/Cu (Ni) Interface under Thermal-Shearing Cycling Condition

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    New search for: Jihua, H.
    New search for: Jiangang, Z.

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    Growth Behavior of Intermetallic Compounds on Sn-3.5Ag-0.5Cu/Cu (Ni) Interface under Thermal-Shearing Cycling Condition

    New search for: Lihua, Q.
    New search for: Jihua, H.
    New search for: Jiangang, Z.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Growth Behavior of Intermetallic Compounds on Sn-3.5Ag-0.5Cu/Cu (Ni) Interface under Thermal-Shearing Cycling Condition

    New search for: Lihua, Q.
    New search for: Jihua, H.
    New search for: Jiangang, Z.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

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    Document information
    Similar titles

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    Document information
    Title:

    Growth Behavior of Intermetallic Compounds on Sn-3.5Ag-0.5Cu/Cu (Ni) Interface under Thermal-Shearing Cycling Condition

    Contributors:

    Lihua, Q. (author) / Jihua, H. (author) / Jiangang, Z. (author)

    Published in:

    RARE METAL MATERIALS AND ENGINEERING ; 36 ; 241-244

    Publication date:

    2007-01-01

    Size:

    4 pages

    ISSN:

    1002-185X

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    Unknown

    Classification:

    DDC:  669

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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