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    Effect of Ag3Sn intermetallic compounds on corrosion of Sn-3.0Ag-0.5Cu solder under high-temperature and high-humidity condition

    New search for: Wang, M.
    New search for: Wang, J.
    New search for: Feng, H.
    New search for: Ke, W.

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    Effect of Ag3Sn intermetallic compounds on corrosion of Sn-3.0Ag-0.5Cu solder under high-temperature and high-humidity condition

    New search for: Wang, M.
    New search for: Wang, J.
    New search for: Feng, H.
    New search for: Ke, W.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Effect of Ag3Sn intermetallic compounds on corrosion of Sn-3.0Ag-0.5Cu solder under high-temperature and high-humidity condition

    New search for: Wang, M.
    New search for: Wang, J.
    New search for: Feng, H.
    New search for: Ke, W.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
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    Document information
    Similar titles

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    Document information
    Title:

    Effect of Ag3Sn intermetallic compounds on corrosion of Sn-3.0Ag-0.5Cu solder under high-temperature and high-humidity condition

    Contributors:

    Wang, M. (author) / Wang, J. (author) / Feng, H. (author) / Ke, W. (author)

    Published in:

    CORROSION SCIENCE ; 63 ; 20-28

    Publication date:

    2012-01-01

    Size:

    9 pages

    ISSN:

    0010-938X

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.16205 / 620

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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