Fachinformationsdienst BAUdigital

A platform for research: civil engineering, architecture and urbanism

    Microstructural Effects on Low Cycle Fatigue of Sn-3.8Ag-0.7Cu Pb-Free Solder

    New search for: Zeng, Q. L.
    New search for: Wang, Z. G.
    New search for: Shang, J. K.
    New search for: Nam, S. W.
    New search for: Chang, Y. W.
    New search for: Lee, S. B.
    New search for: Kim, N. J.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Microstructural Effects on Low Cycle Fatigue of Sn-3.8Ag-0.7Cu Pb-Free Solder

    New search for: Zeng, Q. L.
    New search for: Wang, Z. G.
    New search for: Shang, J. K.
    New search for: Nam, S. W.
    New search for: Chang, Y. W.
    New search for: Lee, S. B.
    New search for: Kim, N. J.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Microstructural Effects on Low Cycle Fatigue of Sn-3.8Ag-0.7Cu Pb-Free Solder

    New search for: Zeng, Q. L.
    New search for: Wang, Z. G.
    New search for: Shang, J. K.
    New search for: Nam, S. W.
    New search for: Chang, Y. W.
    New search for: Lee, S. B.
    New search for: Kim, N. J.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Microstructural Effects on Low Cycle Fatigue of Sn-3.8Ag-0.7Cu Pb-Free Solder

    Contributors:

    Zeng, Q. L. (author) / Wang, Z. G. (author) / Shang, J. K. (author) / Nam, S. W. / Chang, Y. W. / Lee, S. B. / Kim, N. J.

    Published in:

    The Mechanical Behavior of Materials X ; 239-242

    KEY ENGINEERING MATERIALS ; 345/346

    Publication date:

    2007-01-01

    Size:

    4 pages

    ISSN:

    1013-9826

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

    Similar titles

    Effects of Current Stressing on Shear Properties of Sn-3.8Ag-0.7Cu Solder Joints

    Wang, X.J. / Zeng, Q.L. / Zhu, Q.S. et al. | British Library Online Contents | 2010

    Enhanced stress relaxation of Sn-3.8Ag-0.7Cu solder by electrical current

    Liu, H. / Zhu, Q. / Zhang, L. et al. | British Library Online Contents | 2010

    Some aspects of nucleation and growth in lead free Sn-3.8Ag-0.7Cu alloy

    Snugovsky, L. / Snugovsky, P. / Perovic, D. D. et al. | British Library Online Contents | 2005

    Low cycle fatigue study of lead free 99.3Sn-0.7Cu solder alloy

    Pang, J. H. / Xiong, B. S. / Low, T. H. | British Library Online Contents | 2004

    Microstructures Variations of Sn-9Zn-1Al and Sn-8Zn-3Bi Solder Pastes with Sn-3.8Ag-0.7Cu Solder Balls on OSP PCBs after Thermal Cycling Test

    Wang, M.-C. / Lin, C.-T. / Hsi, C.-S. et al. | British Library Online Contents | 2013

    Back to top