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    Enhanced stress relaxation of Sn-3.8Ag-0.7Cu solder by electrical current

    New search for: Liu, H.
    New search for: Zhu, Q.
    New search for: Zhang, L.
    New search for: Wang, Z.
    New search for: Shang, J.K.

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    Enhanced stress relaxation of Sn-3.8Ag-0.7Cu solder by electrical current

    New search for: Liu, H.
    New search for: Zhu, Q.
    New search for: Zhang, L.
    New search for: Wang, Z.
    New search for: Shang, J.K.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Enhanced stress relaxation of Sn-3.8Ag-0.7Cu solder by electrical current

    New search for: Liu, H.
    New search for: Zhu, Q.
    New search for: Zhang, L.
    New search for: Wang, Z.
    New search for: Shang, J.K.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Enhanced stress relaxation of Sn-3.8Ag-0.7Cu solder by electrical current

    Contributors:

    Liu, H. (author) / Zhu, Q. (author) / Zhang, L. (author) / Wang, Z. (author) / Shang, J.K. (author)

    Published in:

    JOURNAL OF MATERIALS RESEARCH -PITTSBURGH THEN WARRENDALE- ; 25 ; 1172-1178

    Publication date:

    2010-01-01

    Size:

    7 pages

    ISSN:

    0884-2914

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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