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A platform for research: civil engineering, architecture and urbanism
Microstructures Variations of Sn-9Zn-1Al and Sn-8Zn-3Bi Solder Pastes with Sn-3.8Ag-0.7Cu Solder Balls on OSP PCBs after Thermal Cycling Test
Microstructures Variations of Sn-9Zn-1Al and Sn-8Zn-3Bi Solder Pastes with Sn-3.8Ag-0.7Cu Solder Balls on OSP PCBs after Thermal Cycling Test
Microstructures Variations of Sn-9Zn-1Al and Sn-8Zn-3Bi Solder Pastes with Sn-3.8Ag-0.7Cu Solder Balls on OSP PCBs after Thermal Cycling Test
Wang, M.-C. (author) / Lin, C.-T. (author) / Hsi, C.-S. (author) / Chang, T.-C. (author) / Liang, M.-K. (author) / Huang, H.-H. (author)
MATERIALS TRANSACTIONS ; 54 ; 332-336
2013-01-01
5 pages
Article (Journal)
English
DDC:
620.11
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