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Vibration fracture behavior of Sn–9Zn–xCu lead-free solders

Hung, F. Y. / Lui, T. S. / Chen, L. H. / You, J. G.

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Vibration fracture behavior of Sn–9Zn–xCu lead-free solders

Hung, F. Y. / Lui, T. S. / Chen, L. H. / You, J. G.

Vibration fracture behavior of Sn–9Zn–xCu lead-free solders

Hung, F. Y. / Lui, T. S. / Chen, L. H. / You, J. G.

Access

Access via TIB

Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

Vibration fracture behavior of Sn–9Zn–xCu lead-free solders

Contributors:

Hung, F. Y. (author) / Lui, T. S. (author) / Chen, L. H. (author) / You, J. G. (author)

Published in:

JOURNAL OF MATERIALS SCIENCE ; 42 ; 3865-3873

Publication date:

2007-01-01

Size:

9 pages

ISSN:

0022-2461

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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