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Fatigue fracture mechanisms of Cu/lead-free solders interfaces

Zhang, Q. K. / Zhu, Q. S. / Zou, H. F. / Zhang, Z. F.

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Fatigue fracture mechanisms of Cu/lead-free solders interfaces

Zhang, Q. K. / Zhu, Q. S. / Zou, H. F. / Zhang, Z. F.

Fatigue fracture mechanisms of Cu/lead-free solders interfaces

Zhang, Q. K. / Zhu, Q. S. / Zou, H. F. / Zhang, Z. F.

Access

Access via TIB

Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

Fatigue fracture mechanisms of Cu/lead-free solders interfaces

Contributors:

Zhang, Q. K. (author) / Zhu, Q. S. (author) / Zou, H. F. (author) / Zhang, Z. F. (author)

Published in:

MATERIALS SCIENCE AND ENGINEERING A ; 527 ; 1367-1376

Publication date:

2010-01-01

Size:

10 pages

ISSN:

0921-5093

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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