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Electromigration induced microstructure and morphological changes in eutectic SnPb solder joints

Lee, A. / Ho, C. E. / Subramanian, K. N.

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Electromigration induced microstructure and morphological changes in eutectic SnPb solder joints

Lee, A. / Ho, C. E. / Subramanian, K. N.

Electromigration induced microstructure and morphological changes in eutectic SnPb solder joints

Lee, A. / Ho, C. E. / Subramanian, K. N.

Access

Access via TIB

Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

Electromigration induced microstructure and morphological changes in eutectic SnPb solder joints

Contributors:

Lee, A. (author) / Ho, C. E. (author) / Subramanian, K. N. (author)

Published in:

JOURNAL OF MATERIALS RESEARCH -PITTSBURGH THEN WARRENDALE- ; 22 ; 3265-3272

Publication date:

2007-01-01

Size:

8 pages

ISSN:

0884-2914

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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