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Electromigration at the high-Pb-eutectic SnPb solder interface

Lai, C. L. / Lin, C. H. / Chen, C.

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Electromigration at the high-Pb-eutectic SnPb solder interface

Lai, C. L. / Lin, C. H. / Chen, C.

Electromigration at the high-Pb-eutectic SnPb solder interface

Lai, C. L. / Lin, C. H. / Chen, C.

Access

Access via TIB

Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

Electromigration at the high-Pb-eutectic SnPb solder interface

Contributors:

Lai, C. L. (author) / Lin, C. H. (author) / Chen, C. (author)

Published in:

JOURNAL OF MATERIALS RESEARCH -PITTSBURGH THEN WARRENDALE- ; 19 ; 550-556

Publication date:

2004-01-01

Size:

7 pages

ISSN:

0884-2914

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

Lu, C. M. / Shao, T. L. / Yang, C. J. et al. | British Library Online Contents | 2004

Electromigration induced microstructure and morphological changes in eutectic SnPb solder joints

Lee, A. / Ho, C. E. / Subramanian, K. N. | British Library Online Contents | 2007

Damages and microstructural variation of high-lead and eutectic SnPb composite flip chip solder bumps induced by electromigration

Liu, Y.-H. / Lin, K.-L. | British Library Online Contents | 2005

Electromigration-induced Pb and Sn whisker growth in SnPb solder stripes

Wei, C.C. / Liu, P.C. / Chen, C. et al. | British Library Online Contents | 2008

Stress Relaxation and Fatigue Characterisation of Eutectic SnPb Solder Alloy

Hashim, M.A. / Rahmat, A. | British Library Online Contents | 2011