Microstructural evolution during electromigration in eutectic SnAg solder bumps

Chen, Y. H. / Shao, T. L. / Liu, P. C. et al. | British Library Online Contents | 2005

Electromigration induced microstructure and morphological changes in eutectic SnPb solder joints

Lee, A. / Ho, C. E. / Subramanian, K. N. | British Library Online Contents | 2007

Electromigration at the high-Pb-eutectic SnPb solder interface

Lai, C. L. / Lin, C. H. / Chen, C. | British Library Online Contents | 2004

Damages and microstructural variation of high-lead and eutectic SnPb composite flip chip solder bumps induced by electromigration

Liu, Y.-H. / Lin, K.-L. | British Library Online Contents | 2005

Tensile fracture behaviors of solid-state-annealed eutectic SnPb and lead-free solder flip chip bumps

Jang, J.-W. / De Silva, A. P. / Lin, J.-K. et al. | British Library Online Contents | 2004