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Multiple Surface Cracking of a Piezoelectric Layer Bonded to an Elastic Substrate Under Dynamic Anti-plane Electromechanical Impacts
Multiple Surface Cracking of a Piezoelectric Layer Bonded to an Elastic Substrate Under Dynamic Anti-plane Electromechanical Impacts
Multiple Surface Cracking of a Piezoelectric Layer Bonded to an Elastic Substrate Under Dynamic Anti-plane Electromechanical Impacts
Wang, B.L. (author) / Han, J.C. (author)
JOURNAL OF INTELLIGENT MATERIAL SYSTEMS AND STRUCTURES ; 18 ; 1203-1214
2007-01-01
12 pages
Article (Journal)
English
DDC:
620.11
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