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    An anti-plane shear crack in bonded functionally graded piezoelectric materials under electromechanical loading

    New search for: Ding, S. H.
    New search for: Li, X.

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    An anti-plane shear crack in bonded functionally graded piezoelectric materials under electromechanical loading

    New search for: Ding, S. H.
    New search for: Li, X.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    An anti-plane shear crack in bonded functionally graded piezoelectric materials under electromechanical loading

    New search for: Ding, S. H.
    New search for: Li, X.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

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    Document information
    Similar titles

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    Document information
    Title:

    An anti-plane shear crack in bonded functionally graded piezoelectric materials under electromechanical loading

    Contributors:

    Ding, S. H. (author) / Li, X. (author)

    Published in:

    COMPUTATIONAL MATERIALS SCIENCE ; 43 ; 337-344

    Publication date:

    2008-01-01

    Size:

    8 pages

    ISSN:

    0927-0256

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.1 / 510

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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