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A New Technology for Chemical Polishing of Copper in Weak Alkaline Solution

Jing, T. / Zhang, Z.-c. / Li, G.-w. / Zhao, F.

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A New Technology for Chemical Polishing of Copper in Weak Alkaline Solution

Jing, T. / Zhang, Z.-c. / Li, G.-w. / Zhao, F.

A New Technology for Chemical Polishing of Copper in Weak Alkaline Solution

Jing, T. / Zhang, Z.-c. / Li, G.-w. / Zhao, F.

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Access via TIB

Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

A New Technology for Chemical Polishing of Copper in Weak Alkaline Solution

Contributors:

Jing, T. (author) / Zhang, Z.-c. (author) / Li, G.-w. (author) / Zhao, F. (author)

Published in:

CORROSION SCIENCE AND PROTECTION TECHNOLOGY ; 19 ; 367-370

Publication date:

2007-01-01

Size:

4 pages

ISSN:

1002-6495

Type of media:

Article (Journal)

Type of material:

Language:

Unknown

Classification:

DDC: 620.11223

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