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A New Technology for Chemical Polishing of Copper in Weak Alkaline Solution
A New Technology for Chemical Polishing of Copper in Weak Alkaline Solution
A New Technology for Chemical Polishing of Copper in Weak Alkaline Solution
Jing, T. (Autor:in) / Zhang, Z.-c. (Autor:in) / Li, G.-w. (Autor:in) / Zhao, F. (Autor:in)
CORROSION SCIENCE AND PROTECTION TECHNOLOGY ; 19 ; 367-370
01.01.2007
4 pages
Aufsatz (Zeitschrift)
Unbekannt
DDC:
620.11223
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