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    Study on Removal Mechanism of Fixed-Abrasive Diamond Wire Saw Slicing Monocrystalline Silicon

    New search for: Gao, Y.F.
    New search for: Ge, P.Q.
    New search for: Hou, Z.J.
    New search for: Xu, J.
    New search for: Xu, X.
    New search for: Cai, G.
    New search for: Kang, R.

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    Study on Removal Mechanism of Fixed-Abrasive Diamond Wire Saw Slicing Monocrystalline Silicon

    New search for: Gao, Y.F.
    New search for: Ge, P.Q.
    New search for: Hou, Z.J.
    New search for: Xu, J.
    New search for: Xu, X.
    New search for: Cai, G.
    New search for: Kang, R.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Study on Removal Mechanism of Fixed-Abrasive Diamond Wire Saw Slicing Monocrystalline Silicon

    New search for: Gao, Y.F.
    New search for: Ge, P.Q.
    New search for: Hou, Z.J.
    New search for: Xu, J.
    New search for: Xu, X.
    New search for: Cai, G.
    New search for: Kang, R.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

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    Document information
    Title:

    Study on Removal Mechanism of Fixed-Abrasive Diamond Wire Saw Slicing Monocrystalline Silicon

    Contributors:

    Gao, Y.F. (author) / Ge, P.Q. (author) / Hou, Z.J. (author) / Xu, J. / Xu, X. / Cai, G. / Kang, R.

    Published in:

    Advances in Grinding and Abrasive Technology XIV ; 450-454

    KEY ENGINEERING MATERIALS ; 359/360

    Publication date:

    2008-01-01

    Size:

    5 pages

    ISSN:

    1013-9826

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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