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Effect of displacement rate on bump shear properties of electroplated solder bumps in flip-chip packages

Koo, J. M. / Kim, Y. N. / Yoon, J. W. / Kim, D. G. / Noh, B. I. / Kim, J. W. / Moon, J. H. / Jung, S. B.

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Effect of displacement rate on bump shear properties of electroplated solder bumps in flip-chip packages

Koo, J. M. / Kim, Y. N. / Yoon, J. W. / Kim, D. G. / Noh, B. I. / Kim, J. W. / Moon, J. H. / Jung, S. B.

Effect of displacement rate on bump shear properties of electroplated solder bumps in flip-chip packages

Koo, J. M. / Kim, Y. N. / Yoon, J. W. / Kim, D. G. / Noh, B. I. / Kim, J. W. / Moon, J. H. / Jung, S. B.

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Check availability in my library

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Document information

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Document information

Title:

Effect of displacement rate on bump shear properties of electroplated solder bumps in flip-chip packages

Contributors:

Koo, J. M. (author) / Kim, Y. N. (author) / Yoon, J. W. (author) / Kim, D. G. (author) / Noh, B. I. (author) / Kim, J. W. (author) / Moon, J. H. (author) / Jung, S. B. (author)

Published in:

MATERIALS SCIENCE AND ENGINEERING A ; 483/484 ; 620-624

Publication date:

2008-01-01

Size:

5 pages

ISSN:

0921-5093

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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