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Effect of displacement rate on bump shear properties of electroplated solder bumps in flip-chip packages
Effect of displacement rate on bump shear properties of electroplated solder bumps in flip-chip packages
Effect of displacement rate on bump shear properties of electroplated solder bumps in flip-chip packages
Koo, J. M. (author) / Kim, Y. N. (author) / Yoon, J. W. (author) / Kim, D. G. (author) / Noh, B. I. (author) / Kim, J. W. (author) / Moon, J. H. (author) / Jung, S. B. (author)
MATERIALS SCIENCE AND ENGINEERING A ; 483/484 ; 620-624
2008-01-01
5 pages
Article (Journal)
English
DDC:
620.11
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