Fachinformationsdienst BAUdigital

A platform for research: civil engineering, architecture and urbanism

    Solder Bump Inspection Evaluating new flip chip designs

    New search for: Asgari, R.
    New search for: Romega-Thompson, V.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Solder Bump Inspection Evaluating new flip chip designs

    New search for: Asgari, R.
    New search for: Romega-Thompson, V.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Solder Bump Inspection Evaluating new flip chip designs

    New search for: Asgari, R.
    New search for: Romega-Thompson, V.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Solder Bump Inspection Evaluating new flip chip designs

    Contributors:

    Asgari, R. (author) / Romega-Thompson, V. (author)

    Published in:

    ADVANCED PACKAGING ; 11 ; 31-36

    Publication date:

    2002-01-01

    Size:

    6 pages

    ISSN:

    1065-0555

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  658.564

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

    Similar titles

    Variable Flip Chip Assembly for High-volume Production Solder Bump and Adhesive Flip Chip Advantages

    Pajonk, J. / Halk, D. R. | British Library Online Contents | 2004

    Reliability analysis of Au-Sn flip-chip solder bump fabricated by co-electroplating

    Yoon, J.-W. / Chun, H.-S. / Jung, S.-B. | British Library Online Contents | 2007

    Flip Chip Bump Formation of Sn-1.8Bi-0.8Cu-0.6In Solder by Stencil Printing

    Lee, J. / Jung, J.-P. / Cheon, C.-S. et al. | British Library Online Contents | 2005

    Fluxless Sn-3.5 mass%Ag Solder Bump Flip Chip Bonding by Ultrasonic Wave

    Hong, S.-M. / Kang, C.-S. / Jung, J.-P. | British Library Online Contents | 2002

    Effect of displacement rate on bump shear properties of electroplated solder bumps in flip-chip packages

    Koo, J. M. / Kim, Y. N. / Yoon, J. W. et al. | British Library Online Contents | 2008

    Back to top