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Measurement of impact toughness of eutectic SnPb and SnAgCu solder joints in ball grid array by mini-impact tester
Measurement of impact toughness of eutectic SnPb and SnAgCu solder joints in ball grid array by mini-impact tester
Measurement of impact toughness of eutectic SnPb and SnAgCu solder joints in ball grid array by mini-impact tester
JOURNAL OF MATERIALS RESEARCH -PITTSBURGH THEN WARRENDALE- ; 23 ; 1482-1487
2008-01-01
6 pages
Article (Journal)
English
DDC:
620.11
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