A Comparative Study of The Fatigue Behavior of SnAgCu and SnPb Solder Joints: Fid-Bau Portal

A Comparative Study of The Fatigue Behavior of SnAgCu and SnPb Solder Joints

Kim, I. H. / Park, T. S. / Yang, S. Y. / Lee, S. B.

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A Comparative Study of The Fatigue Behavior of SnAgCu and SnPb Solder Joints

Kim, I. H. / Park, T. S. / Yang, S. Y. / Lee, S. B.

A Comparative Study of The Fatigue Behavior of SnAgCu and SnPb Solder Joints

Kim, I. H. / Park, T. S. / Yang, S. Y. / Lee, S. B.

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Check availability in my library

Order at Subito €

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Document information

Title:

A Comparative Study of The Fatigue Behavior of SnAgCu and SnPb Solder Joints

Contributors:

Kim, I. H. (author) / Park, T. S. (author) / Yang, S. Y. (author) / Lee, S. B. (author) / Kim, Y.-J. / Bae, D.-H.

Published in:

Advances in Fracture and Strength ; 831-836

KEY ENGINEERING MATERIALS ; 297/300

Publication date:

2005-01-01

Size:

6 pages

ISSN:

1013-9826

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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