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Finite-Element Analysis of Thermal Stresses in Diamond Film Deposition on Mo Substrate with Ti Interlayer
Finite-Element Analysis of Thermal Stresses in Diamond Film Deposition on Mo Substrate with Ti Interlayer
Finite-Element Analysis of Thermal Stresses in Diamond Film Deposition on Mo Substrate with Ti Interlayer
Liu, Z. (author) / Li, C.M. (author) / Niu, D.C. (author) / Lan, H. (author) / Tang, W.Z. (author) / Chen, G.C. (author) / Song, J.H. (author) / Tong, Y.M. (author) / Lu, F.X. (author) / Niu, J.
2008-01-01
6 pages
Article (Journal)
English
DDC:
620.11
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