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Delamination-induced dielectric breakdown in Cu/low-k interconnects
Delamination-induced dielectric breakdown in Cu/low-k interconnects
Delamination-induced dielectric breakdown in Cu/low-k interconnects
JOURNAL OF MATERIALS RESEARCH -PITTSBURGH THEN WARRENDALE- ; 23 ; 1802-1808
2008-01-01
7 pages
Article (Journal)
English
DDC:
620.11
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