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    Reliability Evaluation of QFP Solder Joint Using Sn-8Zn-3Bi Solder Paste during the Thermal Shock Test

    New search for: Han, S.W.
    New search for: Chang, K.H.
    New search for: Han, J.G.
    New search for: Cho, I.J.
    New search for: Kim, J.M.
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    New search for: Kim, Y.T.
    New search for: Shin, Y.E.
    New search for: Lee, C.
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    New search for: Park, D.-H.
    New search for: Na, S.-J.

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    Reliability Evaluation of QFP Solder Joint Using Sn-8Zn-3Bi Solder Paste during the Thermal Shock Test

    New search for: Han, S.W.
    New search for: Chang, K.H.
    New search for: Han, J.G.
    New search for: Cho, I.J.
    New search for: Kim, J.M.
    New search for: Choi, M.G.
    New search for: Kim, Y.T.
    New search for: Shin, Y.E.
    New search for: Lee, C.
    New search for: Lee, J.-B.
    New search for: Park, D.-H.
    New search for: Na, S.-J.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Reliability Evaluation of QFP Solder Joint Using Sn-8Zn-3Bi Solder Paste during the Thermal Shock Test

    New search for: Han, S.W.
    New search for: Chang, K.H.
    New search for: Han, J.G.
    New search for: Cho, I.J.
    New search for: Kim, J.M.
    New search for: Choi, M.G.
    New search for: Kim, Y.T.
    New search for: Shin, Y.E.
    New search for: Lee, C.
    New search for: Lee, J.-B.
    New search for: Park, D.-H.
    New search for: Na, S.-J.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

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    Document information
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    Document information
    Title:

    Reliability Evaluation of QFP Solder Joint Using Sn-8Zn-3Bi Solder Paste during the Thermal Shock Test

    Contributors:

    Han, S.W. (author) / Chang, K.H. (author) / Han, J.G. (author) / Cho, I.J. (author) / Kim, J.M. (author) / Choi, M.G. (author) / Kim, Y.T. (author) / Shin, Y.E. (author) / Lee, C. / Lee, J.-B.

    Published in:

    Advanced Welding and Micro Joining / Packaging for the 21st Century ; 247-250

    MATERIALS SCIENCE FORUM ; 580/582

    Publication date:

    2008-01-01

    Size:

    4 pages

    ISSN:

    0255-5476

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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