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    Acoustic Microscopy of Interfacial Crack in Sn-Ag-Cu Alloy Solder Joints under Shear Fatigue Testing

    New search for: Kato, H.
    New search for: Kobayashi, H.

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    Acoustic Microscopy of Interfacial Crack in Sn-Ag-Cu Alloy Solder Joints under Shear Fatigue Testing

    New search for: Kato, H.
    New search for: Kobayashi, H.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Acoustic Microscopy of Interfacial Crack in Sn-Ag-Cu Alloy Solder Joints under Shear Fatigue Testing

    New search for: Kato, H.
    New search for: Kobayashi, H.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

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    Document information
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    Document information
    Title:

    Acoustic Microscopy of Interfacial Crack in Sn-Ag-Cu Alloy Solder Joints under Shear Fatigue Testing

    Contributors:

    Kato, H. (author) / Kobayashi, H. (author)

    Published in:

    MATERIALS TRANSACTIONS ; 49 ; 2068-2075

    Publication date:

    2008-01-01

    Size:

    8 pages

    ISSN:

    1345-9678

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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