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    Experimental damage mechanics of microelectronic solder joints under fatigue loading

    New search for: Basaran, C.
    New search for: Tang, H.
    New search for: Nie, S.

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    Experimental damage mechanics of microelectronic solder joints under fatigue loading

    New search for: Basaran, C.
    New search for: Tang, H.
    New search for: Nie, S.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Experimental damage mechanics of microelectronic solder joints under fatigue loading

    New search for: Basaran, C.
    New search for: Tang, H.
    New search for: Nie, S.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Experimental damage mechanics of microelectronic solder joints under fatigue loading

    Contributors:

    Basaran, C. (author) / Tang, H. (author) / Nie, S. (author)

    Published in:

    MECHANICS OF MATERIALS ; 36 ; 1111-1121

    Publication date:

    2004-01-01

    Size:

    11 pages

    ISSN:

    0167-6636

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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