Interfacial morphology and shear deformation of flip chip solder joints: Fid-Bau Portal

Interfacial morphology and shear deformation of flip chip solder joints

Jang, J. W. / Liu, C. Y. / Kim, P. G. / Tu, K. N. / Mal, A. K. / Frear, D. R.

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Interfacial morphology and shear deformation of flip chip solder joints

Jang, J. W. / Liu, C. Y. / Kim, P. G. / Tu, K. N. / Mal, A. K. / Frear, D. R.

Interfacial morphology and shear deformation of flip chip solder joints

Jang, J. W. / Liu, C. Y. / Kim, P. G. / Tu, K. N. / Mal, A. K. / Frear, D. R.

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Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

Interfacial morphology and shear deformation of flip chip solder joints

Contributors:

Jang, J. W. (author) / Liu, C. Y. (author) / Kim, P. G. (author) / Tu, K. N. (author) / Mal, A. K. (author) / Frear, D. R. (author)

Published in:

JOURNAL OF MATERIALS RESEARCH -PITTSBURGH- ; 15 ; 1679-1687

Publication date:

2000-01-01

Size:

9 pages

ISSN:

0884-2914

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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