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3D Study of Thermal Stresses in Lead-Free Surface Mount Devices

Hegde, P. / Whalley, D. / Silberschmidt, V.

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3D Study of Thermal Stresses in Lead-Free Surface Mount Devices

Hegde, P. / Whalley, D. / Silberschmidt, V.

3D Study of Thermal Stresses in Lead-Free Surface Mount Devices

Hegde, P. / Whalley, D. / Silberschmidt, V.

Access

Access via TIB

Check availability in my library

Order at Subito €

Page navigation

Document information

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Document information

Title:

3D Study of Thermal Stresses in Lead-Free Surface Mount Devices

Contributors:

Hegde, P. (author) / Whalley, D. (author) / Silberschmidt, V. (author)

Published in:

JOURNAL OF THERMAL STRESSES ; 31 ; 1039-1055

Publication date:

2008-01-01

Size:

17 pages

ISSN:

0149-5739

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.1121

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