Research on Creep Properties of Sn2.5Ag0.7CuXRE Lead-Free Soldered Joints for Surface Mount Technology

Zhang, K.K. (author) / Wang, Y.L. (author) / Fan, Y.L. (author) / Yiang, J. (author) / Yan, Y.F. (author) / Zhang, X. (author) / Zhou, Y. / Tu, S.-T. / Xie, X.

Progresses in Fracture and Strength of Materials and Structures: Part 4: Selected, peer reviewed papers from the Asian Pacific Conference Fracture and Strength 2006 (APCFS'06), held at Sanya, Hainan Island, China during November 22˜25, 2006 ; 2912-2915

KEY ENGINEERING MATERIALS ; 353/358

2007-01-01

4 pages

1013-9826

Article (Journal)

Print

English

DDC:  620.11