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Creep damage study at powercycling of lead-free surface mount device

Hegde, P. / Whalley, D. C. / Silberschmidt, V. V.

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Creep damage study at powercycling of lead-free surface mount device

Hegde, P. / Whalley, D. C. / Silberschmidt, V. V.

Creep damage study at powercycling of lead-free surface mount device

Hegde, P. / Whalley, D. C. / Silberschmidt, V. V.

Access

Access via TIB

Check availability in my library

Order at Subito €

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Document information

Similar titles

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Document information

Title:

Creep damage study at powercycling of lead-free surface mount device

Contributors:

Hegde, P. (author) / Whalley, D. C. (author) / Silberschmidt, V. V. (author)

Published in:

COMPUTATIONAL MATERIALS SCIENCE ; 45 ; 638-645

Publication date:

2009-01-01

Size:

8 pages

ISSN:

0927-0256

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.1 / 510

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