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A platform for research: civil engineering, architecture and urbanism
Microelectronic Wire Bonding with Insulated Au Wire: Effects of Process Parameters on Insulation Removal and Crescent Bonding
Microelectronic Wire Bonding with Insulated Au Wire: Effects of Process Parameters on Insulation Removal and Crescent Bonding
Microelectronic Wire Bonding with Insulated Au Wire: Effects of Process Parameters on Insulation Removal and Crescent Bonding
Lee, J. (author) / Mayer, M. (author) / Zhou, N. (author) / Persic, J. (author)
MATERIALS TRANSACTIONS ; 49 ; 2347-2353
2008-01-01
7 pages
Article (Journal)
English
DDC:
620.11
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