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    Ultrasonic Friction Power in Microelectronic Wire Bonding

    New search for: Mayer, M.
    New search for: Zwart, A.
    New search for: Chandra, T.
    New search for: Tsuzaki, K.
    New search for: Militzer, M.
    New search for: Ravindran, C.

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    Ultrasonic Friction Power in Microelectronic Wire Bonding

    New search for: Mayer, M.
    New search for: Zwart, A.
    New search for: Chandra, T.
    New search for: Tsuzaki, K.
    New search for: Militzer, M.
    New search for: Ravindran, C.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Ultrasonic Friction Power in Microelectronic Wire Bonding

    New search for: Mayer, M.
    New search for: Zwart, A.
    New search for: Chandra, T.
    New search for: Tsuzaki, K.
    New search for: Militzer, M.
    New search for: Ravindran, C.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Ultrasonic Friction Power in Microelectronic Wire Bonding

    Contributors:

    Mayer, M. (author) / Zwart, A. (author) / Chandra, T. / Tsuzaki, K. / Militzer, M. / Ravindran, C.

    Published in:

    Supplement to THERMEC 2006, 5th International Conference on PROCESSING & MANUFACTURING OF ADVANCED MATERIALS, July 4-8, 2006, Vancouver, Canada ; 3920-3925

    MATERIALS SCIENCE FORUM ; 539/543

    Publication date:

    2007-01-01

    Size:

    6 pages

    ISSN:

    0255-5476

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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