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Advanced ceramics in wire bonding capillaries for semiconductor package technology
Advanced ceramics in wire bonding capillaries for semiconductor package technology
Advanced ceramics in wire bonding capillaries for semiconductor package technology
Kim, I. J. (author) / Kim, H. S. (author) / Seo, M. Y. (author) / Gauckler, L. J. (author)
MATERIALS SCIENCE AND ENGINEERING A ; 498 ; 129-134
2008-01-01
6 pages
Article (Journal)
English
DDC:
620.11
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