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Conformal Polymer Interconnect for High Density Chip Scale Packages

Robinson, M. / Leal, J. / Andrews, L.

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Conformal Polymer Interconnect for High Density Chip Scale Packages

Robinson, M. / Leal, J. / Andrews, L.

Conformal Polymer Interconnect for High Density Chip Scale Packages

Robinson, M. / Leal, J. / Andrews, L.

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Export, share and cite

Document information

Title:

Conformal Polymer Interconnect for High Density Chip Scale Packages

Contributors:

Robinson, M. (author) / Leal, J. (author) / Andrews, L. (author)

Published in:

ADVANCING MICROELECTRONICS ; 35 ; 20-23

Publication date:

2008-01-01

Size:

4 pages

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 621.381

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