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Electromigration and thermomigration behavior of flip chip solder joints in high current density packages
Electromigration and thermomigration behavior of flip chip solder joints in high current density packages
Electromigration and thermomigration behavior of flip chip solder joints in high current density packages
Yang, D. (author) / Chan, Y.C. (author) / Wu, B.Y. (author) / Pecht, M. (author)
JOURNAL OF MATERIALS RESEARCH -PITTSBURGH THEN WARRENDALE- ; 23 ; 2333-2339
2008-01-01
7 pages
Article (Journal)
English
DDC:
620.11
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