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A platform for research: civil engineering, architecture and urbanism
The effect of hydrogen peroxide on polishing removal rate in CMP with various abrasives
The effect of hydrogen peroxide on polishing removal rate in CMP with various abrasives
The effect of hydrogen peroxide on polishing removal rate in CMP with various abrasives
Manivannan, R. (author) / Ramanathan, S. (author)
APPLIED SURFACE SCIENCE ; 255 ; 3764-3768
2009-01-01
5 pages
Article (Journal)
English
DDC:
621.35
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