Sintered nanosilver paste for high-temperature power semiconductor device attachment: Fid-Bau Portal

Sintered nanosilver paste for high-temperature power semiconductor device attachment

Calata, J.N. / Lei, T.G. / Lu, G.-Q.

Access

Access via TIB

Check availability in my library

Order at Subito €

Page navigation

Document information

Similar titles

Export, share and cite

Sintered nanosilver paste for high-temperature power semiconductor device attachment

Calata, J.N. / Lei, T.G. / Lu, G.-Q.

Sintered nanosilver paste for high-temperature power semiconductor device attachment

Calata, J.N. / Lei, T.G. / Lu, G.-Q.

Access

Access via TIB

Check availability in my library

Order at Subito €

Page navigation

Document information

Similar titles

Export, share and cite

Document information

Title:

Sintered nanosilver paste for high-temperature power semiconductor device attachment

Contributors:

Calata, J.N. (author) / Lei, T.G. (author) / Lu, G.-Q. (author)

Published in:

INTERNATIONAL JOURNAL OF MATERIALS AND PRODUCT TECHNOLOGY ; 34 ; 95-110

Publication date:

2009-01-01

Size:

16 pages

ISSN:

0268-1900

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

Calata, Jesus N. / Lei, Thomas G. / Lu, Guo-Quan | British Library Online Contents | 2009

Applying Anand model to low-temperature sintered nanoscale silver paste chip attachment

Yu, D. j. / Chen, X. / Chen, G. et al. | British Library Online Contents | 2009

Applying Anand model to low-temperature sintered nanoscale silver paste chip attachment

Yu, Dun-ji / Chen, Xu / Chen, Gang et al. | Elsevier | 2009

Influence of temperature and microstructure on the mechanical properties of sintered nanosilver joints

Chen, G. / Wang, Y. Z. / Mei, Y. et al. | British Library Online Contents | 2015

Uniaxial ratcheting behavior of sintered nanosilver joint for electronic packaging

Chen, G. / Yu, L. / Mei, Y. et al. | British Library Online Contents | 2014