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Applying Anand model to low-temperature sintered nanoscale silver paste chip attachment

Yu, D. j. / Chen, X. / Chen, G. / Lu, G. q. / Wang, Z. q.

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Applying Anand model to low-temperature sintered nanoscale silver paste chip attachment

Yu, D. j. / Chen, X. / Chen, G. / Lu, G. q. / Wang, Z. q.

Applying Anand model to low-temperature sintered nanoscale silver paste chip attachment

Yu, D. j. / Chen, X. / Chen, G. / Lu, G. q. / Wang, Z. q.

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Order at Subito €

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Document information

Title:

Applying Anand model to low-temperature sintered nanoscale silver paste chip attachment

Contributors:

Yu, D. j. (author) / Chen, X. (author) / Chen, G. (author) / Lu, G. q. (author) / Wang, Z. q. (author)

Published in:

MATERIALS AND DESIGN -REIGATE- ; 30 ; 4574-4579

Publication date:

2009-01-01

Size:

6 pages

ISSN:

0264-1275

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.0042

Calata, Jesus N. / Lei, Thomas G. / Lu, Guo-Quan | British Library Online Contents | 2009

Sintered nanosilver paste for high-temperature power semiconductor device attachment

Calata, J.N. / Lei, T.G. / Lu, G.-Q. | British Library Online Contents | 2009

Special issue in honor of Lallit Anand

Bronkhorst, C. A. / Kalidindi, S. R. / Zavaliangos, A. et al. | British Library Online Contents | 2010

Low-Temperature Sintering of Nanoscale Silver Paste for Large-Area Joints in Power Electronics Modules

Lei, T.G. / Calata, J. / Luo, S.F. et al. | British Library Online Contents | 2007

2007 Anton Tedesko Fellow - Mr Anand Pravesh Singh

British Library Online Contents | 2008