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A new palladium-free surface activation process for Ni electroless plating on ABS plastic

Tang, X. / Bi, C. / Han, C. / Zhang, B.

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A new palladium-free surface activation process for Ni electroless plating on ABS plastic

Tang, X. / Bi, C. / Han, C. / Zhang, B.

A new palladium-free surface activation process for Ni electroless plating on ABS plastic

Tang, X. / Bi, C. / Han, C. / Zhang, B.

Access

Access via TIB

Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

A new palladium-free surface activation process for Ni electroless plating on ABS plastic

Contributors:

Tang, X. (author) / Bi, C. (author) / Han, C. (author) / Zhang, B. (author)

Published in:

MATERIALS LETTERS ; 63 ; 840-842

Publication date:

2009-01-01

Size:

3 pages

ISSN:

0167-577X

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.1105 / 530

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