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Palladium - Free Activation Process for Electroless Nickel Plating on Silicon Substrate

Ma, H.-f. / Wang, Y.-h. / Xing, Z.-n. / Ma, F. / Ding, Y.-g.

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Palladium - Free Activation Process for Electroless Nickel Plating on Silicon Substrate

Ma, H.-f. / Wang, Y.-h. / Xing, Z.-n. / Ma, F. / Ding, Y.-g.

Palladium - Free Activation Process for Electroless Nickel Plating on Silicon Substrate

Ma, H.-f. / Wang, Y.-h. / Xing, Z.-n. / Ma, F. / Ding, Y.-g.

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Document information

Title:

Palladium - Free Activation Process for Electroless Nickel Plating on Silicon Substrate

Contributors:

Ma, H.-f. (author) / Wang, Y.-h. (author) / Xing, Z.-n. (author) / Ma, F. (author) / Ding, Y.-g. (author)

Published in:

MATERIALS PROTECTION -WUHAN- ; 44 ; 48-50

Publication date:

2011-01-01

Size:

3 pages

ISSN:

1001-1560

Type of media:

Article (Journal)

Type of material:

Language:

Unknown

Classification:

DDC: 620.1

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