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Effect of Cu addition on whisker formation in tin-rich solder alloys under thermal shock stress
Effect of Cu addition on whisker formation in tin-rich solder alloys under thermal shock stress
Effect of Cu addition on whisker formation in tin-rich solder alloys under thermal shock stress
Skwarek, A. (author) / Ratajczak, J. (author) / Czerwinski, A. (author) / Witek, K. (author) / Kulawik, J. (author)
APPLIED SURFACE SCIENCE ; 255 ; 7100-7103
2009-01-01
4 pages
Article (Journal)
English
DDC:
621.35
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