Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
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Effect of Cu addition on whisker formation in tin-rich solder alloys under thermal shock stress
Effect of Cu addition on whisker formation in tin-rich solder alloys under thermal shock stress
Effect of Cu addition on whisker formation in tin-rich solder alloys under thermal shock stress
Skwarek, A. (Autor:in) / Ratajczak, J. (Autor:in) / Czerwinski, A. (Autor:in) / Witek, K. (Autor:in) / Kulawik, J. (Autor:in)
APPLIED SURFACE SCIENCE ; 255 ; 7100-7103
01.01.2009
4 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
621.35
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